PDK Application Engineer – Design Automation

Job ID: JR0186513 Job Category: Engineering Primary Location: Santa Clara, CA US Other Locations: US, Arizona, Phoenix;US, California, Folsom;US, Oregon, Hillsboro;US, Texas, Austin Job Type: College Grad

PDK Application Engineer
– Design Automation

Job Description

About the Group:

As an integral part of Intel’s new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO.

IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally.

Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe
– available for customers globally
– and a world-class IP portfolio that customers can choose from including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs.

If you have a strong technical background and like customer interaction, this is the position for you.

Intel Foundry Services (IFS) Applications Engineering team is looking for independent, self-motivated candidates with strong technical skills in SOC/IP/ASIC design and methodology to work with our customers.

As part of our IFS group, you will help drive IFS technologies and solutions into customer’s engineering teams as well as be the customer advocate working back with internal development teams.

You will ensure Intel collaterals and services can continuously meet IFS customers’ needs that would lead to successful chip tape-outs.

Joining this group means you will be representing Intel enabling customers’ satisfying experiences and eventual outcome, financial success.

Opportunity to learn and expand your knowledge on various physical design domains is an additional benefit.

In this role you will:

• Collaborate with physical design domain experts, design and develop exploratory, automated Quality Assurance (QA) flow in ICF AE environment, enabling automation at various stages of testing
  – Integration, Functional testing, Regression, End-to-End (E2E) and User Acceptance Testing (UAT), to ensure Intel collateral quality improvement.
• Drive innovation and initiatives to enhance existing automation, tools and methodologies, and to minimize the manual testing efforts.
• Maintain, execute QA flow to generate test reports per collateral release, including but not limited to design kit, run set, and library, which not only can be used to continuously monitor quality escapes and drive corrective actions with internal development teams but also can be released to customers.
• Work with the QA analysts, add new usage models and testcases, either from customers or synthetic, to prevent recurring quality issues in Intel collaterals.
• Drive quality design kit content and its documentation delivered to customers.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Experienced listed could be a combination of relevant course work, internships or on the job experience.

Education Requirement:

• Bachelor’s degree in Electrical Engineering, Science, Computer Science, Engineering, or related field of stud with 2+ years of experience OR Master’s degree in Electrical Engineering, Science, Computer Science, Engineering or related field of study.

Minimum Requirements:

• 1+ year experience in physical design (silicon IP/SOC/ASIC)
• 1+ year experience in scripting languages like Perl, Tcl, Python, and/or shell scripting.
• 1+ year experience with CMOS processes.

Preferred Qualifications:

• Programming experience in SKILL, Perl, or other equivalent scripting language, including but not limited to flow-related issue debug/fix, new solution/enhancement development, productivity/quality-increasing automation, etc.
• Experience with providing technical direction to engineering teams, including but not limited to customer support, driving methodologies and BKMs to streamline physical design work, speccing guidelines and checklists, driving execution, and tracking progress while offering physical verification support.
• Familiar with physical design flow domains, like synthesis, layout design, fill, DRC/LVS, parasitic extraction, etc.
• Practical experience with one of the IaaS public cloud offerings (MS Azure, Amazon AWS, Google) in semiconductor design/EDA Virtual Design Environment (VDE).

Inside this Business Group

As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art –
– from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.

Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Arizona, Phoenix;US, California, Folsom;US, Oregon, Hillsboro;US, Texas, Austin

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.